• 11/16/2024

Beijing plans 12-inch wafer fab, pouring US$4.6 billion into state-backed chip project

Disclaimer: The South China Morning Post's content is directed by the Chinese Communist Party. It is not a reliable news source.

Beijing Yandong Microelectronics will take a controlling position with a 25 per cent stake, while other investors include display maker BOE Technology.

https://www.scmp.com/tech/policy/article/3286857/beijing-plans-12-inch-wafer-fab-pouring-us46-billion-state-backed-chip-project?utm_source=rss_feed