• 11/13/2024

Hua Hong Semiconductor Plans to Raise Close to $3.0 Billon in Chinese IPO

Wall Street Journal

Chinese chipmaker Hua Hong Semiconductor plans to raise $2.95 billion through an initial public offering on Shanghai’s STAR board on Tuesday.

https://www.wsj.com/articles/hua-hong-semiconductor-plans-to-raise-close-to-3-0-billon-in-chinese-ipo-de6b100f