Q&A/ Delving into TSMC’s planned CoWoS packaging plants in Chiayi
Taipei, March 19 (CNA) Contract chipmaker Taiwan Semiconductor Manufacturing Co. (TSMC) is set to build two packaging plants using the sophisticated Chip on Wafer on Substrate (CoWoS) technology at the Chiayi Science Park in southern Taiwan, with construction of the first plant scheduled to begin in May and mass production in 2028.